合格电子签名硬件设备与海量高吞吐远程云签名金库

部署具备完全国家法律效力的远程硬件签名模块,提供与手写签名完全等同的法律证据链,实现用户唯一控制下的密钥集中托管与全自动软件供应链代码签名。

SignHSM High-Throughput Signing Architecture

Cryptographic Enclave: QSCD Cryptographic Engine — CC EAL4+ / EN 419 241-2 Core

Hardware Security Nodes & Co-Processors

  • Signature Activation Module (SAM)
  • Multi-Tenant RSA/ECDSA Engine
  • RFC 3161 Hardware Timestamp Engine
  • PAdES / XAdES / CAdES Formatter
  • Automated Code Signing Vault

Architectural Layers & Silicon Defenses

  • Layer 1: Certified QSCD Hardware Enclave (FIPS 140-3 L4 / CC EAL4+ AVA_VAN.5): Physically protecting private signing keys against invasive attacks with microsecond tamper zeroization.
  • Layer 2: Signature Activation & Sole Control (SAM) (EN 419 241-2 Signature Activation Protocol): Cryptographically verifying that the signer has sole control over key activation via dual-factor biometric tokens.
  • Layer 3: ETSI Baseline Packaging & Timestamping (RFC 3161 / ETSI EN 319 102-1 Validation): Generating PAdES B-LTA and XAdES B-LTA signatures with embedded long-term validation (LTV) cryptographic timestamps.
  • Layer 4: Enterprise Signing & CI/CD Cloud Gateway (Cloud Signature Consortium (CSC) / PKCS#11): Interfacing signing engines with enterprise ERPs, cloud document platforms, and GitHub/GitLab build pipelines.

Cryptographic Telemetry & Compliance: 120,000/s (RSA-2048 Signing Throughput) | eIDAS Art 25 (Handwritten Signature Parity) | < 8 ms (Remote Signature Latency) | EAL4+ VAN.5 (Common Criteria Certification)

仅由用户独占控制的具有法律约束力的密码签名

Enterprise digital transformation requires signing hundreds of thousands of transactions, invoices, and software binaries daily without compromising key custody. SignHSM fulfills the stringent demands of eIDAS Article 29 and EN 419 241-2 by executing qualified remote electronic signatures inside tamper-resistant hardware where user authorization is cryptographically verified before every single signature.

Core Engineering Areas

Technical Publications

Related Cluster Architecture Specifications